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in september 2023, intel took the lead in announcing the launch of advanced packaging glass substrates, with mass production planned from 2026 to 2030. the initiative stems from a decade of research and investment to achieve the goal of integrating one trillion transistors on a single package by 2030. samsung has also joined this competition and plans to put its glass substrate trial production line into operation before september this year, establish a pilot line in 2024, mass produce samples in 2025, and finally complete formal mass production in 2026. sk hynix is also actively planning and plans to start mass production in early 2025, becoming one of the first companies to add glass substrates. morgan stanley updated the supply chain situation of nvidia gb200, saying that the supply chain of nvidia gb200 dgx/mgx has been launched and will use glass substrates for advanced packaging.
however, glass substrates were not an overnight breakthrough. it also faces huge challenges, ranging from insufficient technological maturity to difficult processing and high costs. industry insiders believe that the advantage of glass lies in overcoming warpage and electrical performance problems, but it has outstanding shortcomings such as fragility and difficulty in processing, and further efforts are needed to achieve mass production yield before actual delivery. enterprises need to make huge upfront investments. even if they invest heavily in technology development, if the business cannot make a profit, it will become a sunk cost.
however, the potential of glass substrates cannot be ignored. as a new technology for high-end applications, it requires close interaction with the industry chain to reach consensus on technical routes and products. it takes time and a concerted effort to ultimately achieve success. with the further development and market promotion of technology, the market size of glass substrates will become larger and larger, eventually driving the chip industry to new heights.
