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in recent years, giants such as intel, samsung, and sk hynix have announced that they will join the glass substrate camp and plan their future development routes. the advantage of glass substrates is that they overcome warpage and electrical performance issues and are easy to process and manufacture, bringing new possibilities to high-end applications. however, the road to commercialization of glass substrate technology has not been smooth sailing.

although glass substrate technology has achieved impressive results in the research and development stage, its practical application faces many challenges. the fragility and processing difficulty of glass, as well as potential cost issues, have become important factors hindering development. industry insiders pointed out that the market penetration rate of glass substrates will experience accelerated growth, reaching 30% within 3 years and exceeding 50% within 5 years. however, this rapid development trend also brings new opportunities, allowing the industry to focus on technology research and development and industrial chain optimization, and ultimately achieve market maturity.

schott, a company specializing in semiconductor packaging solutions, will debut its semiconductor packaging solutions based on special glass at the china international import expo in november this year. this program aims to break through traditional technology bottlenecks and bring new breakthroughs to the chip industry.

as an important part of the future development direction of chips, glass substrates will play an important role in the rapid development driven by computing power. as the market scale expands and technology maturity improves, the application scope of glass substrates will be further expanded and point out the future direction for the development of high-end chip fields.